Method for encapsulating electrical components

A method for encapsulating electrical components in capsules filled with a hardenable plastics material, said capsules being part of a mould having a trough-shaped pouring ingate mounted above and in fluid communication with the entrances of said capsules, said capsules being provided with holes in their bottom portions and being spaced from one another along said trough-shaped pouring ingate, each of said electrical components to be provided with a first electrical connection wire connected to a first terminal of said electrical component, and a second electrical connection wire connected to a second terminal of said electrical component, said method comprising:

• the steps of inserting said electrical components into said capsules such that the connection wires pass through the holes provided in the bottoms of the capsules, one electrical component for each of said capsules;
• pouring a liquid hardenable plastics material into said trough-shaped pouring ingate, said step of pouring comprising pouring a surplus amount of said liquid hardenable plastics material so that an excess amount of said material remains in said trough-shaped pouring ingate after all of said capsules have been filled, and pouring said material into said trough-shaped pouring ingate under vacuum;
• curing said liquid hardenable plastics material;
• and separating said trough-shaped pouring ingate along with the excess hardened plastics material from said thus-formed encapsulated components such that a plurality of individual encapsulated components results.