H01F 41/005
Impregnating or encapsulating
Official title: {Impregnating or encapsulating (insulating of windings H01F41/12)}
H01F41/005 (Impregnating or encapsulating) appears on 286 US grants and 350 published applications in this corpus.
Search patents in H01F- Granted patents
- 286
- Published applications
- 350
- Assignees
- 198
- Inventors
- 903
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 1 |
| 2002 | 5 | 5 |
| 2003 | 3 | 1 |
| 2004 | 6 | 6 |
| 2005 | 3 | 2 |
| 2006 | 3 | 8 |
| 2007 | 3 | 9 |
| 2008 | 6 | 6 |
| 2009 | 1 | 9 |
| 2010 | 6 | 12 |
| 2011 | 5 | 6 |
| 2012 | 3 | 7 |
| 2013 | 9 | 32 |
| 2014 | 11 | 29 |
| 2015 | 8 | 31 |
| 2016 | 23 | 11 |
| 2017 | 22 | 19 |
| 2018 | 14 | 13 |
| 2019 | 16 | 13 |
| 2020 | 9 | 18 |
| 2021 | 13 | 15 |
| 2022 | 9 | 18 |
| 2023 | 16 | 18 |
| 2024 | 13 | 28 |
| 2025 | 14 | 20 |
| 2026 | 11 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inductance element and inductance element fabrication method6 Oct 2026US 12,755,886 B2Lapis Semiconductor Co., Ltd.
- Manufacturing method of coil component and coil component29 Sep 2026US 12,746,712 B2Sumida Corporation
- Dry-type transformer and winding method thereof1 Sep 2026US 12,725,727 B2Huawei Digital Power Technologies Co., Ltd.
- Casting dry-type transformer and manufacturing method thereof30 Jun 2026US 12,671,026 B2Haihong Electric Co., Ltd.
- Hybrid bonded passive integrated devices on glass core30 Jun 2026US 12,672,239 B2Intel Corporation
- Improved temperature-stable soft-magnetic powder24 Sep 2026US 2026/0290665 A1BASF SE
- Magnetic Device Having Shielding Layer20 Aug 2026US 2026/0245788 A1Cyntec Co., Ltd.
- Powder magnetic core, inductor, and method for manufacturing powder magnetic core23 Jul 2026US 2026/0213059 A1Tokin Corporation
- Module with Reversely Coupled Inductors and Magnetic Molded Compound (MMC)16 Jul 2026US 2026/0204474 A1Texas Instruments Incorporated
- Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same2 Jul 2026US 2026/0188562 A1Chipletz, Inc.
Most cited
By later US patents
- Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit96US 6,437,673 B1Canon Kabushiki Kaisha · 2002
- Wire wound electronic component84US 6,198,373 B1Taiyo Yuden Co., Ltd. · 2001
- Method of making a molded transformer enclosure57US 5,056,214 AMark IV Industries Limited · 1991
- Method of making an encapsulated high efficiency transformer and power supply57US 5,524,334 A1996
- Method of manufacturing a power module49US 7,426,780 B2Enpirion, Inc. · 2008