Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same

An inductor adapted for use in a semiconductor package, said inductor comprising:

• a substrate core;
• a plurality of trenches in said substrate core;
• a conductive material deposited in said plurality of trenches in said substrate core;
• a first insulative layer on a first surface of said substrate core and a first surface of said conductive material deposited in said plurality of trenches in said substrate core;
• an inductive pattern formed by at least:
• a first via hole, beginning at a surface of said first insulative layer, through said first insulative layer, terminating at said first surface of said conductive material deposited in said plurality of trenches in said substrate core;
• a second insulative layer on said surface of said first insulative layer and in said first via hole;
• and
• a second via hole, beginning at a surface of said second insulative layer, through said second insulative layer, terminating at said first surface of said conductive material deposited in said plurality of trenches in said substrate core.