H01F 2017/046
Helical coil made of flat wire
Official title: {helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis}
H01F2017/046 (Helical coil made of flat wire) appears on 118 US grants and 154 published applications in this corpus.
Search patents in H01F- Granted patents
- 118
- Published applications
- 154
- Assignees
- 70
- Inventors
- 310
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 4 |
| 2003 | 2 | 4 |
| 2004 | 4 | 9 |
| 2005 | 6 | 3 |
| 2006 | 4 | 16 |
| 2007 | 7 | 7 |
| 2008 | 8 | 4 |
| 2009 | 2 | 3 |
| 2010 | 4 | 9 |
| 2011 | 2 | 3 |
| 2012 | 4 | 5 |
| 2013 | 4 | 2 |
| 2014 | 2 | 2 |
| 2015 | 0 | 2 |
| 2016 | 3 | 4 |
| 2017 | 1 | 4 |
| 2018 | 5 | 12 |
| 2019 | 3 | 14 |
| 2020 | 13 | 17 |
| 2021 | 5 | 4 |
| 2022 | 11 | 8 |
| 2023 | 10 | 2 |
| 2024 | 4 | 7 |
| 2025 | 2 | 3 |
| 2026 | 9 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Manufacturing method of coil component and coil component29 Sep 2026US 12,746,712 B2Sumida Corporation
- Flat coil carrier18 Aug 2026US 12,712,117 B2Mahle International GmbH
- Electronic component19 May 2026US 12,633,441 B2Coilcraft, Incorporated
- Inductor apparatus optimized for low power loss in class-D audio amplifier applications and method for making the same5 May 2026US 12,620,523 B2Crestron Electroncics, Inc.
- Coil former, inductive component and method for adjusting an inductance5 May 2026US 12,621,909 B2Philip Morris Products S. A.
- Magnetic Device and the Method to Make the Same30 Jul 2026US 2026/0221333 A1Cyntec Co., Ltd.
- Coil component9 Jul 2026US 2026/0196400 A1Samsung Electro-Mechanics Co., Ltd.
- Inductor and method for manufacturing the same11 Jun 2026US 2026/0162862 A1Chilisin Electronics Corp.
- Coil component28 May 2026US 2026/0148890 A1Samsung Electro-Mechanics Co., Ltd.
- Coil component14 May 2026US 2026/0135028 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- High current, low profile inductor93US 6,204,744 B1Vishay Dale Electronics, Inc. · 2001
- Inductive component and inductive component assembly88US 6,114,932 ATelefonaktiebolaget LM Ericsson · 2000
- Method for making a high current, low profile inductor72US 6,460,244 B1Vishay Dale Electronics, Inc. · 2002
- Surface mount coil with edgewise winding43US 6,922,130 B2Minebea Co., Ltd. · 2005
- Coil-embedded dust core and method for manufacturing the same38US 6,791,445 B2TDK Corporation · 2004