H01F 17/045
With core of cylindric geometry and coil wound along its longitudinal axis
Official title: {with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core}
H01F17/045 (With core of cylindric geometry and coil wound along its longitudinal axis) appears on 838 US grants and 1,027 published applications in this corpus.
Search patents in H01F- Granted patents
- 838
- Published applications
- 1,027
- Assignees
- 257
- Inventors
- 1,449
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 13 | 0 |
| 2001 | 10 | 3 |
| 2002 | 16 | 23 |
| 2003 | 20 | 22 |
| 2004 | 30 | 32 |
| 2005 | 21 | 32 |
| 2006 | 22 | 39 |
| 2007 | 28 | 35 |
| 2008 | 28 | 31 |
| 2009 | 18 | 31 |
| 2010 | 24 | 31 |
| 2011 | 18 | 19 |
| 2012 | 18 | 10 |
| 2013 | 11 | 19 |
| 2014 | 14 | 17 |
| 2015 | 8 | 26 |
| 2016 | 17 | 29 |
| 2017 | 21 | 39 |
| 2018 | 22 | 75 |
| 2019 | 36 | 74 |
| 2020 | 54 | 89 |
| 2021 | 53 | 82 |
| 2022 | 50 | 80 |
| 2023 | 95 | 59 |
| 2024 | 72 | 53 |
| 2025 | 46 | 53 |
| 2026 | 39 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Manufacturing method of coil component and coil component29 Sep 2026US 12,746,712 B2Sumida Corporation
- Coil component29 Sep 2026US 12,749,612 B2Samsung Electro-Mechanics Co., Ltd.
- Coil device22 Sep 2026US 12,744,147 B2TDK Corporation
- Coil device and electronic circuit8 Sep 2026US 12,731,714 B2TDK Corporation
- Coupled inductor18 Aug 2026US 12,712,116 B2Cyntec Co., Ltd.
- Integrally formed inductor and its manufacturing method for the same13 Aug 2026US 2026/0237543 A1HONG DANG Technology Co., Ltd.
- Magnetic Device and the Method to Make the Same30 Jul 2026US 2026/0221333 A1Cyntec Co., Ltd.
- Stylus pen16 Jul 2026US 2026/0202924 A1HiDeep Inc.
- Coil component9 Jul 2026US 2026/0196400 A1Samsung Electro-Mechanics Co., Ltd.
- Magnetic field cancellation based on wire routing2 Jul 2026US 2026/0188551 A1NVIDIA Corporation
Most cited
By later US patents
- High current, low profile inductor93US 6,204,744 B1Vishay Dale Electronics, Inc. · 2001
- Inductive component and inductive component assembly88US 6,114,932 ATelefonaktiebolaget LM Ericsson · 2000
- Wire wound electronic component84US 6,198,373 B1Taiyo Yuden Co., Ltd. · 2001
- Integrated circuit inductor with a magnetic core79US 6,531,945 B1Micron Technology, Inc. · 2003
- Method for making a high current, low profile inductor72US 6,460,244 B1Vishay Dale Electronics, Inc. · 2002