H01C 7/04
Non-adjustable resistors formed as one or more layers or coatings: having negative
Official title: having negative temperature coefficient
H01C7/04 (Non-adjustable resistors formed as one or more layers or coatings: having negative) appears on 456 US grants and 402 published applications in this corpus.
Search patents in H01C- Granted patents
- 456
- Published applications
- 402
- Assignees
- 220
- Inventors
- 931
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 13 | 0 |
| 1978 | 5 | 0 |
| 1979 | 10 | 0 |
| 1980 | 15 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 0 | 0 |
| 1984 | 8 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 8 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 8 | 0 |
| 1998 | 1 | 0 |
| 1999 | 7 | 0 |
| 2000 | 14 | 0 |
| 2001 | 4 | 2 |
| 2002 | 5 | 10 |
| 2003 | 4 | 7 |
| 2004 | 3 | 5 |
| 2005 | 5 | 7 |
| 2006 | 5 | 3 |
| 2007 | 6 | 6 |
| 2008 | 4 | 5 |
| 2009 | 8 | 9 |
| 2010 | 6 | 9 |
| 2011 | 7 | 12 |
| 2012 | 8 | 7 |
| 2013 | 10 | 19 |
| 2014 | 6 | 11 |
| 2015 | 12 | 35 |
| 2016 | 10 | 18 |
| 2017 | 21 | 25 |
| 2018 | 23 | 14 |
| 2019 | 14 | 17 |
| 2020 | 19 | 27 |
| 2021 | 26 | 33 |
| 2022 | 23 | 31 |
| 2023 | 13 | 14 |
| 2024 | 25 | 34 |
| 2025 | 20 | 23 |
| 2026 | 10 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer electronic component11 Aug 2026US 12,706,245 B2KYOCERA Corporation
- Composite thermistor element28 Jul 2026US 12,695,009 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Thermistor integrated with a bias resistor30 Jun 2026US 12,671,018 B2Texas Instruments Incorporated
- Electronic component9 Jun 2026US 12,651,683 B2Murata Manufacturing Co., Ltd.
- Temperature measurement arrangement in a power module26 May 2026US 12,638,341 B2ABB E-mobility B.V.
- Thermistor sintered body and method for manufacturing thermistor sintered body3 Sep 2026US 2026/0260792 A1Shibaura Electronics Co., Ltd.
- Integrated thermal throttling in light-emitting diode chips and packages20 Aug 2026US 2026/0247768 A1CreeLED, Inc.
- Multilayer electronic component30 Jul 2026US 2026/0221343 A1KYOCERA Corporation
- Ceramic sensor with metallization layers16 Jul 2026US 2026/0204460 A1
- Sensor element and method for manufacturing a sensor element9 Jul 2026US 2026/0194400 A1TDK Electronics Co., Ltd.
Most cited
By later US patents
- Refractory electrical device127US 5,085,804 ANorton Company · 1992
- Refractory electrical device100US 5,045,237 ANorton Company · 1991
- Low thermal expansive, electroconductive composite ceramics99US 4,098,725 ATokyo Denki Kagaku Kogyo Kabushiki Kaisha · 1978
- Thermistor materials and elements83US 4,952,902 ATDK Corporation · 1990
- High efficiency printhead containing a novel oxynitride-based resistor system52US 6,299,294 B1Hewlett-Packard Company · 2001