H01C 17/07
By resistor foil bonding
Official title: by resistor foil bonding, e.g. cladding
H01C17/07 (By resistor foil bonding) appears on 44 US grants and 21 published applications in this corpus.
Search patents in H01C- Granted patents
- 44
- Published applications
- 21
- Assignees
- 35
- Inventors
- 79
- Latest grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 3 |
| 2003 | 1 | 0 |
| 2004 | 2 | 2 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 3 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 2 | 3 |
| 2018 | 2 | 1 |
| 2019 | 0 | 1 |
| 2020 | 2 | 3 |
| 2021 | 1 | 1 |
| 2022 | 2 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance and preparation method therefor8 Jul 2025US 12,354,774 B2Jiangsu New Linzhi Electronic Technology Co., Ltd.
- Method for manufacturing miniature resistor14 Feb 2023US 11,581,112 B2Ralec Electronic Corporation
- Resistor manufacturing method and resistor4 Oct 2022US 11,462,343 B2Koa Corporation
- Shunt resistor for detecting the status of an electrical energy storage unit23 Aug 2022US 11,422,157 B2Robert Bosch GmbH
- Method for manufacturing resistor12 Jan 2021US 10,892,074 B2Koa Corporation
- Manufacturing method for an electrical resistor4 Sep 2025US 2025/0279229 A1Isabellenhütte Heusler GmbH & Co. KG
- Positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance and preparation method therefor19 Sep 2024US 2024/0312678 A1Jiangsu New Linzhi Electronic Technology Co., Ltd.
- Method for manufacturing miniature resistor13 Jan 2022US 2022/0013262 A1Ralec Electronic Corporation
- Shunt resistor for detecting the status of an electrical energy storage unit27 May 2021US 2021/0156888 A1Robert Bosch GmbH
- Resistor manufacturing method and resistor17 Dec 2020US 2020/0395150 A1Koa Corporation
Most cited
By later US patents
- Method for producing a tube69US 7,155,812 B1Sandia Corporation · 2007
- Tape element and methods, for heating, pressure measurement and circuit fabrication55US 4,823,106 ATapeswitch Corporation of America · 1989
- Hybrid and multi-layer circuitry52US 4,712,161 AOlin Corporation · 1987
- Method for manufacturing an integral thin-film metal resistor38US 6,232,042 B1Motorola, Inc. · 2001
- Method of forming and connecting a resistive layer on a pc board31US 4,777,718 AMotorola, Inc. · 1988