Hybrid and multi-layer circuitry
AssigneeOlin Corporation
InventorsMichael J. Pryor, Charles J. Leedecke, Norman G. Masse
Life of this patent
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Abstract
The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a deoxidized or oxygen free copper alloy foil bonded thereto by a bonding glass. The copper alloy foil may be a circuit to which a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits.
Claims29
The process of forming a circuit assembly, comprising the steps of:
- providing a ceramic substrate;
- providing a layer of copper alloy foil, said copper alloy selected from the group consisting of deoxidized copper alloy and oxygen free copper alloy;
- providing a bonding glass which forms a flowable mass at a temperature of less than about 1000.degree. C.;
- disposing a layer of said bonding glass between said substrate and the layer of foil;
- and
- firing the assembly of the foil layer, the layer of glass and the substrate at a temperature of less than about 1000.degree. C. under reducing conditions whereby the layer of glass bonds the foil layer to said substrate.
A circuit assembly, comprising:
- a ceramic substrate,
- a layer of copper alloy foil, said copper alloy selected from the group consisting of oxygen free and deoxidized copper alloy;
- and
- a layer of bonding glass which forms a flowable mass at a temperature below about 1000.degree. C. bonding the ceramic substrate to said layer of alloy foil.
A multi-layer circuit assembly, comprising:
- a first ceramic substrate,
- a first layer of copper alloy foil;
- a bonding glass which forms a flowable mass at a temperature below about 1000.degree. C., first and second layers of said bonding glass being disposed on first and second opposing surfaces of said first substrate, respectively, said first layer of bonding glass bonding said first layer of copper alloy foil to the first surface of said first substrate;
- at least a second ceramic substrate, said second ceramic substrate having at least a third layer of said bonding glass on a first surface thereof;
- at least a second layer of copper alloy foil, said second layer of copper foil being bonded to said second ceramic substrate by a third layer of said bonding glass;
- said first and second layers of copper alloy foil having circuitry formed therein,
- said first and second layers of copper alloy foil being selected from the group consisting of oxygen free copper alloy and deoxidized copper alloy;
- said first and second ceramic substrates having first and second layers of copper foil bonded thereon, respectively, being stacked and bonded to each other with said second layer of bonding glass whereby said second layer of copper alloy foil is disposed adjacent the second surface of said first substrate.
A ceramic side-brazed package comprising a ceramic substrate having a cavity therein;
- a copper alloy circuit foil having a first surface bonded to said ceramic substrate, said copper alloy foil being selected from the group consisting of oxygen-free copper alloy and deoxidized copper alloy;
- a ceramic layer disposed on a second surface of said circuit foil;
- a first layer of bonding glass between said ceramic substrate and a first surface of said circuit foil and a second layer of bonding glass between the ceramic layer and a second surface of said circuit foil for bonding the foil between the ceramic layer and the ceramic substrate.
Dependencies are inferred from the claim text.