Method for manufacturing miniature resistor
AssigneeRalec Electronic Corporation
InventorTim WANG
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.
Claims6
A method for manufacturing a miniature resistor, comprising the steps of:
- (A) providing a foil sheet made of an electrically conductive material having a predetermined resistance value;
- (B) forming a plurality of slits penetrating through the foil sheet and arranged in multiple longitudinal and transverse rows so as to define a patterned foil sheet, the patterned foil sheet including a plurality of resistor blanks arranged in a matrix array, a plurality of connecting regions situated at intersections of the longitudinal and transverse rows, and a framing strip that loops around the resistor blanks, the slits and the connecting regions, the slits aligned in each of the longitudinal and transverse rows being spaced apart from each other at intersections of the longitudinal and transverse rows, the resistor blanks being connected to each other by the connecting regions and the framing strip;
- (C) forming a resin film made of an insulating material on a bottom surface of the patterned foil sheet in such a manner that the insulating material fills all of the slits;
- (D) forming a plurality of protruding blocks made of an electrically conductive material on a top surface of each of the resistor blanks opposite to the resin film;
- (E) forming an encapsulating layer made of an insulating material on the top surface of each of the resistor blanks without covering outer surfaces of the protruding blocks on each of the resistor blanks;
- (F) performing a die cutting process to cut the resin film along the slits, the connecting regions and the framing strip so as to obtain individual resistor blanks that are separated from one another;
- and
- (G) forming two external electrodes respectively on the protruding blocks and on two opposite side surfaces of each of the individual resistor blanks, which are situated at two opposite ends of the top surface of the resistor blank so as to obtain the miniature resistor.
Dependencies are inferred from the claim text.