H01C 1/084
Using self-cooling
Official title: using self-cooling, e.g. fins, heat sinks
H01C1/084 (Using self-cooling) appears on 120 US grants and 88 published applications in this corpus.
Search patents in H01C- Granted patents
- 120
- Published applications
- 88
- Assignees
- 77
- Inventors
- 252
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 2 | 4 |
| 2004 | 1 | 2 |
| 2005 | 1 | 2 |
| 2006 | 3 | 3 |
| 2007 | 4 | 1 |
| 2008 | 0 | 8 |
| 2009 | 1 | 4 |
| 2010 | 3 | 2 |
| 2011 | 5 | 3 |
| 2012 | 5 | 3 |
| 2013 | 1 | 3 |
| 2014 | 4 | 1 |
| 2015 | 2 | 7 |
| 2016 | 3 | 3 |
| 2017 | 0 | 2 |
| 2018 | 6 | 4 |
| 2019 | 8 | 6 |
| 2020 | 5 | 4 |
| 2021 | 2 | 5 |
| 2022 | 5 | 5 |
| 2023 | 1 | 5 |
| 2024 | 4 | 6 |
| 2025 | 6 | 0 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Heat sink thermal transfer system for zinc oxide varistors84US 4,335,417 AGeneral Electric Company · 1982
- Resistors obtained from sheet material72US 4,588,976 AMicroelettrica Scientifica S.P.S. · 1986
- Resistor adapted for use in forced ventilation dynamic braking applications71US 6,081,183 AEaton Corporation · 2000
- Heat softening thermally conductive compositions and methods for their preparation51US 6,783,692 B2Dow Corning Corporation · 2004
- Positive temperature coefficient semiconductor heating device35US 4,037,082 AMurata Manufacturing Co., Ltd. · 1977