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US 6,783,692 B2Granted
Heat softening thermally conductive compositions and methods for their preparation
AssigneeDow Corning Corporation
InventorDorab Edul Bhagwagar
Life of this patent
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Abstract
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.
Claims28
A composition comprising:
- A) a matrix comprising
- i) 4 to 60% based on the weight of the composition of a silicone resin, and
- ii) 0 to 35% based on the weight of the composition of a silicone polymer;
- B) 40 to 96% based on the weight of the composition of a thermally conductive filler;
- C) 0 to 5% based on the weight of the composition of a treating agent;
- and
- D) 0 to 1% based on the weight of the composition of an antioxidant:
- where component i) comprises a DT resin, an MQ resin, or a combination thereof.
5 more elements
The composition of chum 1, where component ii) is present and has the formula (R1R2R3SiO1/2)2(R1 R2SiO2/2)e, where
- each R1 independently represents a hydroxyl group or an organic group,
- each R2 independently represents a hydroxyl group or an organic group,
- each R3 independently represents a hydroxyl group or an organic group,
- e is at least 5, and
- e is up to 800.
2 more elements
The interface material of claim further comprising II) a release sheet covering a surface of the composition opposite the substrate.
Dependencies are inferred from the claim text.