Thin film resistor with viabar structure

A thin-film resistor (TFR), comprising:

• a first conductive line in a first dielectric layer;
• a resistive layer over the first conductive line;
• at least one viabar structure coupled to the resistive layer and including a first viabar portion electrically connected to the resistive layer at a first edge thereof and a second viabar portion electrically connected to the first conductive line;
• a heat sink in the first dielectric layer under the resistive layer;
• and
• a second conductive line separate from the first conductive line, and wherein the second conductive line is coupled to the second viabar portion and is under a second edge opposing the first edge of the resistive layer.

A thin-film resistor (TFR), comprising:

• a first conductive line and a second conductive line;
• a resistive layer over the first conductive line and the second conductive line;
• a first viabar structure partially landed over the resistive layer and electrically connected to a first edge of the resistive layer and partially landed on the first conductive line;
• a second viabar structure partially landed over the resistive layer and electrically connected to a second edge opposing the first edge of the resistive layer and partially landed on the second conductive line;
• and
• a tertiary conductive line coupled to an upper end of the second viabar structure, the tertiary conductive line coupled to a third viabar structure coupled to at least an additional conductive line in a same metal layer as the first conductive line.