H01B 3/38
Condensation products of aldehydes with amines or amides
Official title: condensation products of aldehydes with amines or amides
H01B3/38 (Condensation products of aldehydes with amines or amides) appears on 9 US grants and 17 published applications in this corpus.
Search patents in H01B- Granted patents
- 9
- Published applications
- 17
- Assignees
- 10
- Inventors
- 35
- Latest grant
- 7 Jan 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 2 |
| 2014 | 1 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 1 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 2 |
By publication year.
Recent patents
- Insulated wire, coil, and electrical or electronic equipment7 Jan 2020US 10,529,463 B2Furukawa Electric Co., Ltd.
- Transparent conductive film22 Jan 2019US 10,186,346 B2Nitto Denko Corporation
- Transparent conductive film19 Jun 2018US 10,002,687 B2Nitto Denko Corporation
- Negative dielectric constant material based on ion conducting materials15 Aug 2017US 9,734,932 B2The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- Dielectric layer for an electronic device31 Mar 2015US 8,994,016 B2Xerox Corporation
- Biodegradable hardware22 May 2025US 2025/0167532 A1Liberty Hardware Mfg.Corp.
- Biodegradable hardware22 May 2025US 2025/0167533 A1Liberty Hardware Mfg.Corp.
- Biodegradable hardware1 Feb 2024US 2024/0039260 A1Liberty Hardware Mfg.Corp.
- Intumescent flame-retardant coiled material for cables and intumescent flame-retardant cable22 Sep 2022US 2022/0301741 A13M Innovative Properties Company
- Insulated wire, coil, and electrical or electronic equipment4 Jul 2019US 2019/0206590 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material12US 6,899,960 B2Intel Corporation · 2005
- Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material9US 7,179,684 B2Intel Corporation · 2007
- Insulated wire, coil, and electrical or electronic equipment4US 10,529,463 B2Furukawa Electric Co., Ltd. · 2020
- Negative dielectric constant material based on ion conducting materials1US 8,696,940 B2The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 2014