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US 6,899,960 B2Granted
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
AssigneeIntel Corporation
InventorsSong-Hua Shi, Lejun Wang, Tian-An Chen
Life of this patent
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Abstract
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:
Claims19
An electronic assembly, comprising:
- a substrate;
- a film adhered to an upper surface of the substrate, the film including a polybenzoxazine polymer and a plurality of columnar members;
- and
- an electronic die adhered to an upper surface of the film, wherein each columnar member within the film electrically connects a respective contact on the die with a respective pad on the substrate.
1 more element
Dependencies are inferred from the claim text.