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US 7,179,684 B2Granted
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
AssigneeIntel Corporation
InventorsSong-Hua Shi, Lejun Wang, Tian-An Chen
Life of this patent
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Abstract
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:
Claims19
A method for constructing an electronic assembly, comprising:
- adhering a film to a substrate, the film including a polybenzoxazine polymer and a plurality of columnar members;
- and
- adhering an electronic die to the film, wherein each columnar member within the film electrically connects a respective contact on the die with a respective pad on the substrate.
Dependencies are inferred from the claim text.