G06T 2207/30152
Solder
G06T2207/30152 (Solder) appears on 271 US grants and 288 published applications in this corpus.
Search patents in G06T- Granted patents
- 271
- Published applications
- 288
- Assignees
- 188
- Inventors
- 761
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 6 | 0 |
| 2002 | 6 | 7 |
| 2003 | 11 | 7 |
| 2004 | 7 | 13 |
| 2005 | 7 | 14 |
| 2006 | 10 | 6 |
| 2007 | 5 | 3 |
| 2008 | 6 | 3 |
| 2009 | 4 | 2 |
| 2010 | 6 | 5 |
| 2011 | 6 | 13 |
| 2012 | 5 | 7 |
| 2013 | 6 | 7 |
| 2014 | 4 | 8 |
| 2015 | 7 | 4 |
| 2016 | 6 | 5 |
| 2017 | 4 | 3 |
| 2018 | 7 | 11 |
| 2019 | 9 | 13 |
| 2020 | 8 | 9 |
| 2021 | 10 | 21 |
| 2022 | 10 | 30 |
| 2023 | 21 | 28 |
| 2024 | 13 | 23 |
| 2025 | 23 | 23 |
| 2026 | 16 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for evaluating voids and particles in solids6 Oct 2026US 12,755,355 B2Schlumberger Technology Corporation
- Method for quality control of a welding joint between a pair of ends of conducting elements of an inductive winding of a stator15 Sep 2026US 12,734,616 B2ATOP S.p.A.
- Weld-line generating apparatus, method for generating weld line, and program for generating weld line25 Aug 2026US 12,715,059 B2Kobe Steel, Ltd.
- Autonomous welding robots25 Aug 2026US 12,715,139 B2Path Robotics, Inc.
- Scan planning and scan operations for welding an object18 Aug 2026US 12,708,955 B2Path Robotics, Inc.
- Weld seam detection method and apparatus, electronic device, and storage medium8 Oct 2026US 2026/0307180 A1Contemporary Amperex Technology Co., Limited
- Solder fillet inspecting device and solder fillet inspecting method17 Sep 2026US 2026/0278778 A1Ckd Corporation
- Synthetic image generation for solder joint inspection10 Sep 2026US 2026/0268474 A1Raytheon Company
- Method and device for non-destructively testing a connection point in a component assembly3 Sep 2026US 2026/0259157 A1EJOT GmbH & Co. KG
- Method, electronic device, and system for detecting defect of solder paste27 Aug 2026US 2026/0251590 A1Wiwynn Corporation
Most cited
By later US patents
- Inspection system for cross-sectional imaging201US 5,592,562 AInternational Business Machines Corporation · 1997
- Inspection system for cross-sectional imaging165US 5,719,952 AInternational Business Machines Corporation · 1998
- Information search and retrieval system157US 6,463,426 B1Massachusetts Institute of Technology · 2002
- Automatic X-ray determination of solder joint and view Delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography136US 6,665,433 B2Agilent Technologies, Inc. · 2003
- Method and apparatus for inspection of specular, three-dimensional features125US 5,058,178 AAT&T Bell Laboratories · 1991