Inspection system for cross-sectional imaging

A method of inspecting a bonded joint between a first and a second component at connectors of said components, comprising the steps of:

• using penetrating radiation to generate cross-sectional images of said joint generated:
• in a first plane intersecting the longitudinal axis of said joint extending between said components at:
• a) a position substantially medial of said joint between said components, and
• in a second plane at one of:
• b) a position substantially at said first component, and
• b1) a position substantially at said second component;
• determining the location of the centroid of said bonded joint in said cross-sectional image taken at said medial position;
• determining the location of the centroid of said bonded joint in one of said cross-sectional images taken at a connector of one of said first and second components;
• determining an offset of said joint by comparing said image of the centroid of said joint taken at said medial position to said image of the centroid of said joint taken at said connector;
• and
• comparing said offset to a predetermined value to determine the acceptability of said joint.

A method of inspecting a solder joint between components comprising the steps of:

• generating cross-sectional images of the joint in a plurality of substantially parallel spaced planes intersecting said joint,
• determining the location of a first characteristic of said joint comprising the centroid of said joint in one of said cross-sectional images;
• measuring a second characteristic of said joint in reference to the location of said centroid of said joint in another of said other cross-sectional images;
• and
• comparing the location of said first and second characteristics of said joints with a predetermined specification for the purpose of determining the quality of said joint.

A method of inspecting solder joints between components comprising the steps of:

• using a stored cross-sectional image of the joints generated in at least one of parallel planes intersecting said joints;
• determining the location of a first characteristic of each of said joints, said characteristic comprising the centroid of each said joint in one of said cross-sectional images;
• and
• measuring a second characteristic of each of said joints in reference to the location of said centroids,
• wherein said components comprise a component module having terminations and a substrate to which said electronic component is attached, and
• said solder joints comprise solder joints for joining said terminations of said electronic component and corresponding substrate connection means on said substrate.

A method of inspecting multiple solder joints between components comprising the steps of:

• using a cross-sectional image of the joints generated in a plane intersecting said joints between said components;
• determining the location of a first characteristic of each of said joints, said characteristic comprising the centroid of each said joints in said cross-sectional image;
• and
• measuring a second characteristic of each of said joints in reference to the location of said centroids,
• wherein the relationship between said measurement of said characteristic and the location of said centroids is determined and compared to predetermined specifications for the purpose of determining the quality of said joints.

A method of inspecting ball grid array solder joints between components comprising the steps of:

• generating a cross-sectional image of the joints in a plane intersecting said joints between said components;
• determining the location of the centroid of each solder ball in said joints in said cross-sectional image;
• and
• measuring a characteristic of each of said joints in reference to the location of said centroids,
• wherein the relationship between said measurements of said characteristic and the location of said centroids is determined and compared to predetermined specifications for the purpose of determining the quality of said joints.