Method and apparatus for inspection of specular, three-dimensional features
AssigneeAT&T Bell Laboratories
InventorRajarshi Ray
Life of this patent
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AssigneeAT&T Bell Laboratories
InventorRajarshi Ray
Estimating the term…
Defective or missing solder bumps (18) on a surface (13) of an article (10) such as a chip carrier are detected by first illuminating the surface with dark field illumination. Next, the image of the surface of the article is captured, typically by a television camera (30). The captured image is processed to detect defects by first creating a window (57) in the image about each group of solder bumps and then creating a bounding box (58) about each bump in each window. Each of a set of attributes, including: the number, size and location of the windows, the size location and number of boxes in each window, and the dimensions, shape and brightness of the image in each box, is measured. The value of each attribute is compared to a reference value, representing the value of the attribute when no defects are present. If the attribute differs by more than a predetermined tolerance for its reference value, than a particular defect is prevent. Verification of certain defects may be accomplished by repeating the above-described process using bright field illumination.
A method for inspecting an article to detect missing and defective specular, topographical features on its surface and deformations in the topology of such features comprising the steps of:
Apparatus for inspecting an article having at least one solder bump on its surface to detect if the bump is missing or deformed, comprising:
Dependencies are inferred from the claim text.