G01P 15/0897
By thermal pick-up
Official title: {by thermal pick-up (G01P15/008 takes precedence)}
G01P15/0897 (By thermal pick-up) appears on 6 US grants and 9 published applications in this corpus.
Search patents in G01P- Granted patents
- 6
- Published applications
- 9
- Assignees
- 8
- Inventors
- 14
- Latest grant
- 23 Aug 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 2 | 2 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
By publication year.
Recent patents
- Electrical connector, fluid state test device and fluid heat exchange system23 Aug 2022US 11,421,916 B2Beijing Goldwind Science & Creation Windpower Equipment Co., Ltd.
- Electronic device for measuring a physical parameter13 Apr 2021US 10,976,340 B2EM Microelectronic-Marin SA
- Semiconductor device26 Apr 2016US 9,322,837 B2Renesas Electronics Corporation
- Acceleration sensor16 Feb 2016US 9,261,529 B2Renesas Electronics Corporation
- Functional device23 Aug 2011US 8,003,193 B2Hitachi, Ltd.
- Electrical connector, fluid state test device and fluid heat exchange system27 Aug 2020US 2020/0271355 A1Beijing Goldwind Science & Creation Windpower Equipment Co., Ltd.
- Electronic device for measuring a physical parameter13 Jun 2019US 2019/0178909 A1EM Microelectronic-Marin SA
- Circuit device, electronic apparatus, and moving object15 Sep 2016US 2016/0269011 A1Seiko Epson Corporation
- Acceleration sensor5 May 2016US 2016/0124012 A1Renesas Electronics Corporation
- Semiconductor device20 Aug 2015US 2015/0233964 A1Renesas Electronics Corporation
Most cited
By later US patents