Functional device
AssigneeHitachi, Ltd.
InventorsShohei Hata, Eiji Sakamoto, Naoki Matsushima
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Abstract
The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.
Claims6
A functional device comprising,
- a function element section,
- a Si substrate with at least its surface comprised of Si, including said function element section,
- a glass substrate, and
- a first metal film for sealing said functional element section;
- said first metal film for sealing being formed between said Si substrate and said glass substrate,
- wherein said Si substrate and said glass substrate are jointed to each other by an anode junction via said first metal film for sealing;
- and
- wherein said first metal film for sealing comprises a metal film containing Al as a main component and Ti compounds formed between said metal film containing Al and said glass substrate and in contact with both said metal film containing Al and said glass substrate.
Dependencies are inferred from the claim text.