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US 9,322,837 B2Granted
Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsAkira Tanabe, Yasutaka Nakashiba
Life of this patent
Estimating the term…
Abstract
In a semiconductor device, a heater is formed on a surface of a cap chip, and a first temperature sensor and a second temperature sensor are formed on a surface of a base chip. The cap chip and the base chip are laminated through a connection member such that the surfaces oppose to each other. The position of the heater is different from the positions of the temperature sensors in a direction of the lamination. The heater in the cap chip contacts bumps directly.
Claims18
A semiconductor device comprising:
- a gas type acceleration sensor which comprises a heater, a first temperature sensor and a second temperature sensor as components;
- a first chip, on a first surface of which said heater of the components is formed;
- a second chip, on a second surface of which said first temperature sensor and said second temperature sensor of the components are formed;
- and
- a connection member configured to connect said first chip and said second chip electrically,
- wherein said first chip and said second chip are laminated through said connection member such that said first surface and said second surface oppose to each other,
- wherein a position of said heater is different from a position of said first temperature sensor and a position of said second temperature sensor in a direction of the lamination of said first chip and said second chip,
- wherein said first temperature sensor and said second temperature sensor are arranged in a first in-plane direction orthogonal to the lamination direction to sandwich said heater and to oppose to each other,
- wherein one of said first chip and said second chip is a base chip, and the other is a cap chip which is laminated on said base chip, and
- wherein one of the components of said gas type acceleration sensor formed in said cap chip contacts said connection member directly.
7 more elements
A semiconductor device comprising:
- a first chip, on which a temperature sensor of an acceleration sensor is arranged;
- a second chip, on which a heater of said acceleration sensor is arranged;
- and
- a connection member arranged between said first chip and said second chip to partition a space where said temperature sensor and said heater are arranged,
- wherein ends of said heater directly contact said connection member and are electrically connected with said first chip.
2 more elements
A method of manufacturing a semiconductor device which comprises:
- a gas type acceleration sensor which contains a heater, a first temperature sensor and a second temperature sensor as components,
- said method comprising:
- forming said heater of the components on a first surface of a first chip;
- forming said first temperature sensor and said second temperature sensor of the components on a second surface of a second chip;
- and
- flip-connecting said first chip and said second chip through said connection member such that the first surface and the second surface oppose to each other,
- wherein a position of said heater is different from a position of said first temperature sensor and a position of said second temperature sensor in a direction of lamination of said first chip and said second chip,
- wherein aid first temperature sensor and said second temperature sensor are arranged in a direction orthogonal to a first in-plane direction to sandwich said heater and to oppose to each other,
- wherein one of said first chip and said second chip is a base chip, and the other is a cap chip which is laminated on said base chip, and
- wherein one of the components of said gas type acceleration sensor formed on said cap chip contacts said connection member directly.
7 more elements
Dependencies are inferred from the claim text.