F28F 2255/18
Sintered
Official title: sintered
F28F2255/18 (Sintered) appears on 220 US grants and 313 published applications in this corpus.
Search patents in F28F- Granted patents
- 220
- Published applications
- 313
- Assignees
- 196
- Inventors
- 729
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 2 |
| 2003 | 1 | 0 |
| 2004 | 2 | 2 |
| 2005 | 2 | 5 |
| 2006 | 6 | 7 |
| 2007 | 1 | 6 |
| 2008 | 2 | 3 |
| 2009 | 3 | 3 |
| 2010 | 0 | 6 |
| 2011 | 1 | 6 |
| 2012 | 1 | 6 |
| 2013 | 5 | 6 |
| 2014 | 0 | 8 |
| 2015 | 2 | 3 |
| 2016 | 3 | 14 |
| 2017 | 5 | 22 |
| 2018 | 11 | 36 |
| 2019 | 23 | 33 |
| 2020 | 21 | 36 |
| 2021 | 24 | 28 |
| 2022 | 22 | 22 |
| 2023 | 19 | 23 |
| 2024 | 16 | 13 |
| 2025 | 13 | 13 |
| 2026 | 6 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal fiber molded body, temperature regulation unit, and method for manufacturing metal fiber molded body30 Jun 2026US 12,669,299 B2Tomoegawa Co., Ltd.
- Vapor chamber and dendritic wick structure thereof2 Jun 2026US 12,644,653 B2Nidec Chaun-Choung Technology Corporation
- Thin heat pipe with sintered powdered wick structure12 May 2026US 12,624,901 B2Purple Cloud Development Pte. Ltd.
- Integrated heat dissipation module structure12 May 2026US 12,628,314 B2Top Rank Technology Limited
- Heat pipe7 Apr 2026US 12,595,972 B2Furukawa Electric Co., Ltd.
- Heat pipe, electronic device, instrument, and method for manufacturing heat pipe13 Aug 2026US 2026/0239569 A1Sony Interactive Entertainment Inc.
- Thin heat pipe with sintered powdered wick structure6 Aug 2026US 2026/0227133 A1Purple Cloud Development Pte. Ltd.
- Heat dissipation device30 Jul 2026US 2026/0218988 A1Kmw Inc.
- Heat exchanger, manufacturing method, and device9 Jul 2026US 2026/0197972 A1National University Corporation Tokai National Higher Education and Research System
- Heat pipe and manufacturing method of heat pipe11 Jun 2026US 2026/0160500 A1Fujikura Ltd.
Most cited
By later US patents
- Forming structures from CAD solid models580US 6,391,251 B1Optomec Design Company · 2002
- Rechargeable thermal battery for latent energy storage and transfer67US 6,105,659 AJaro Technologies, Inc. · 2000
- Method of manufacturing a block-type heat exchange element56US 4,746,479 ANippon Soken, Inc. · 1988
- Process for producing micro-heat exchangers54US 6,230,408 B1Institut fur Mikrotechnik Mainz GmbH · 2001
- Fabricating method of composite material45US 5,126,102 AKabushiki Kaisha Toshiba · 1992