Heat dissipation device

Abstract

A heat dissipation apparatus comprises: a first-side heat-conducting panel; a second-side heat-conducting panel bonded to the first-side heat-conducting panel and forming, with the first-side heat-conducting panel, a refrigerant flow space in which a refrigerant is filled and undergoes phase change; and a sintered body column assembly disposed on the refrigerant flow space, wherein the sintered body column assembly comprises: a plurality of condenser sintered body columns disposed at a portion corresponding to a condensation end that is involved in condensation of the refrigerant through heat exchange with outside air in the refrigerant flow space; and an evaporator sintered body base disposed at an evaporation end, which is a portion of the refrigerant flow space excluding the condensation end and is closer to heat-generating elements, and connected to at least one of the plurality of condenser sintered body columns, thereby maximizing heat dissipation performance and improving bonding force.

Dependencies are inferred from the claim text.