F28F 13/187
Especially adapted for evaporator surfaces or condenser surfaces
Official title: {especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites}
F28F13/187 (Especially adapted for evaporator surfaces or condenser surfaces) appears on 319 US grants and 331 published applications in this corpus.
Search patents in F28F- Granted patents
- 319
- Published applications
- 331
- Assignees
- 199
- Inventors
- 850
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 7 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 10 | 0 |
| 1988 | 8 | 0 |
| 1989 | 12 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 4 | 6 |
| 2003 | 1 | 5 |
| 2004 | 3 | 4 |
| 2005 | 1 | 3 |
| 2006 | 2 | 7 |
| 2007 | 4 | 12 |
| 2008 | 2 | 8 |
| 2009 | 1 | 14 |
| 2010 | 8 | 22 |
| 2011 | 10 | 12 |
| 2012 | 9 | 13 |
| 2013 | 6 | 13 |
| 2014 | 5 | 22 |
| 2015 | 8 | 13 |
| 2016 | 5 | 12 |
| 2017 | 17 | 22 |
| 2018 | 10 | 20 |
| 2019 | 19 | 14 |
| 2020 | 12 | 23 |
| 2021 | 12 | 17 |
| 2022 | 20 | 19 |
| 2023 | 14 | 17 |
| 2024 | 14 | 13 |
| 2025 | 14 | 13 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Amphiphilic minichannel surface structures to enhance heat transfer coefficient11 Aug 2026US 12,704,333 B2Drexel University
- Multifunctional surface structure for condensation enhancement and preparation method and use thereof11 Aug 2026US 12,704,334 B1Guangzhou Institute of Technology, Xidian University
- Immersion-type liquid cooling heat dissipation structure21 Jul 2026US 12,687,349 B2Amulaire Thermal Technology, Inc.
- Electronic device comprising thermal management chamber using boiling28 Apr 2026US 12,615,743 B2Samsung Electronics Co., Ltd.
- Enhanced channel configuration for heat exchanger to cool power electronics31 Mar 2026US 12,593,427 B2Carrier Corporation
- Solid desiccant system for dehumidification1 Oct 2026US 2026/0295517 A1Carrier Corporation
- Nanostructure Coating Materials and Methods of Use Thereof3 Sep 2026US 2026/0259019 A1Nelumbo Inc.
- Heat exchanger tube25 Jun 2026US 2026/0177333 A1Wieland-Werke AG
- Cooling and dehumidification system2 Apr 2026US 2026/0092711 A1Transaera, Inc.
- Heat-transfer member and method of manufacturing the same19 Feb 2026US 2026/0049778 A1Kyushu University, National University Corporation
Most cited
By later US patents
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Thermoelectric device with evaporating/condensing heat exchanger139US 5,737,923 AMarlow Industries, Inc. · 1998
- Thermoelectric refrigerator with evaporating/condensing heat exchanger113US 6,003,319 AMarlow Industries, Inc. · 1999
- Heat and mass exchanger94US 7,269,966 B2AIL Reasearch, Inc. · 2007
- Heat transfer apparatus84US 4,619,316 AHitachi, Ltd. · 1986