Electronic device comprising thermal management chamber using boiling

An electronic device, comprising:

• a housing comprising a heat source and a thermal management chamber thermally coupled to the heat source;
• and
• a display disposed on the housing opposite the heat source,
• wherein the thermal management chamber comprises a working fluid, and
• wherein the thermal management chamber comprises:
• a first wall disposed adjacent to the heat source and having a hydrophilic first surface;
• a second wall disposed opposite the first wall spaced apart from the heat source and having a hydrophobic second surface;
• and
• a plurality of third walls disposed between the first wall and the second wall,
• wherein the housing further comprises a main body supporting the display,
• wherein the second wall and the plurality of third walls are formed seamlessly with the main body, and
• wherein the housing further comprises a first junction connecting the first wall and the plurality of third walls.