Immersion-type liquid cooling heat dissipation structure

An immersion-type liquid cooling heat dissipation structure, comprising:

• a metal heat dissipation substrate layer;
• and
• a metal film layer;
• wherein the metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant;
• wherein an effective thickness of the metal film layer is less than 500 μm;
• wherein at least a surface of the metal film layer has a plurality of micropores, an effective width of each of the plurality of micropores is between 1 μm and 200 μm, and a depth of each of the plurality of micropores is between 100 nm and 50 μm;
• wherein the plurality of micropores are recessed from the surface of the metal film layer into the surface of the metal heat dissipation substrate layer, and at least some of the plurality micropores are in air communication with one another through the metal heat dissipation substrate layer, so as to increase an amount of bubbles that are generated through the plurality of micropores.