F28D 9/0031
The conduits for one heat-exchange medium being formed by paired plates touching
Official title: {the conduits for one heat-exchange medium being formed by paired plates touching each other (F28D9/0012, F28D9/0025, F28D9/0081, F28D9/04 take precedence)}
F28D9/0031 (The conduits for one heat-exchange medium being formed by paired plates touching) appears on 1,600 US grants and 2,068 published applications in this corpus.
Search patents in F28D- Granted patents
- 1,600
- Published applications
- 2,068
- Assignees
- 751
- Inventors
- 3,640
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 8 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 11 | 0 |
| 1982 | 10 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 7 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 13 | 0 |
| 1989 | 10 | 0 |
| 1990 | 4 | 0 |
| 1991 | 10 | 0 |
| 1992 | 10 | 0 |
| 1993 | 8 | 0 |
| 1994 | 11 | 0 |
| 1995 | 14 | 0 |
| 1996 | 17 | 0 |
| 1997 | 10 | 0 |
| 1998 | 10 | 0 |
| 1999 | 17 | 0 |
| 2000 | 18 | 0 |
| 2001 | 38 | 18 |
| 2002 | 35 | 30 |
| 2003 | 23 | 51 |
| 2004 | 18 | 55 |
| 2005 | 38 | 63 |
| 2006 | 49 | 63 |
| 2007 | 37 | 60 |
| 2008 | 24 | 52 |
| 2009 | 25 | 59 |
| 2010 | 28 | 56 |
| 2011 | 23 | 57 |
| 2012 | 38 | 75 |
| 2013 | 36 | 86 |
| 2014 | 36 | 99 |
| 2015 | 45 | 105 |
| 2016 | 53 | 131 |
| 2017 | 76 | 101 |
| 2018 | 107 | 115 |
| 2019 | 120 | 118 |
| 2020 | 90 | 104 |
| 2021 | 85 | 115 |
| 2022 | 82 | 100 |
| 2023 | 63 | 106 |
| 2024 | 78 | 101 |
| 2025 | 72 | 86 |
| 2026 | 50 | 62 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Designs and applications of a low-drag, high-efficiency microchannel polymer heat exchanger6 Oct 2026US 12,753,981 B2The Regents of the University of California
- Interlocking plate heat exchanger22 Sep 2026US 12,741,309 B2Rtx Corporation
- Heat exchanger8 Sep 2026US 12,728,694 B2Aptiv Technologies AG
- Fluid management apparatus and thermal management system8 Sep 2026US 12,728,696 B2Zhejiang Sanhua Automotive Components Co., Ltd.
- Heat transport device and method for manufacturing same8 Sep 2026US 12,729,919 B2WELCON Inc.
- Heat exchanger core with integrated distributer arrangement8 Oct 2026US 2026/0309433 A1Honeywell International Inc.
- Stackable Aftercooler System1 Oct 2026US 2026/0298555 A1Powerex-Iwata Air Technology, Inc.
- A coupling device, a kit, and a heat transfer arrangement comprising the same17 Sep 2026US 2026/0276325 A1Qvantum Industries AB
- Thermal management apparatus having reduced complexity for use in thermal management system10 Sep 2026US 2026/0264473 A1BorgWarner Inc.
- Single-phase to two-phase fluid heat exchangers and systems thereof10 Sep 2026US 2026/0266551 A1Bergstrom, Inc.
Most cited
By later US patents
- Active microchannel fluid processing unit and method of making131US 6,192,596 B1Battelle Memorial Institute · 2001
- Integrated chemical processing apparatus and processes for the preparation thereof127US 5,690,763 AE. I. Du Pont de Nemours and Company · 1997
- Integrated fuel reformation and thermal management system for solid oxide fuel cell systems120US 6,485,852 B1Delphi Technologies, Inc. · 2002
- Three-circuit stacked plate heat exchanger114US 5,462,113 AFlatPlate, Inc. · 1995
- Spiral ripple circumferential flow heat exchanger98US 5,343,936 ALong Manufacturing Ltd. · 1994