F28D 2021/0031
Radiators for recooling a coolant of cooling systems
Official title: {Radiators for recooling a coolant of cooling systems}
F28D2021/0031 (Radiators for recooling a coolant of cooling systems) appears on 191 US grants and 301 published applications in this corpus.
Search patents in F28D- Granted patents
- 191
- Published applications
- 301
- Assignees
- 165
- Inventors
- 600
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 1 |
| 2003 | 0 | 5 |
| 2004 | 7 | 6 |
| 2005 | 4 | 18 |
| 2006 | 10 | 18 |
| 2007 | 9 | 18 |
| 2008 | 5 | 15 |
| 2009 | 6 | 11 |
| 2010 | 6 | 9 |
| 2011 | 6 | 9 |
| 2012 | 4 | 9 |
| 2013 | 9 | 1 |
| 2014 | 4 | 8 |
| 2015 | 5 | 9 |
| 2016 | 4 | 6 |
| 2017 | 6 | 10 |
| 2018 | 12 | 15 |
| 2019 | 9 | 19 |
| 2020 | 11 | 13 |
| 2021 | 7 | 11 |
| 2022 | 11 | 31 |
| 2023 | 13 | 16 |
| 2024 | 14 | 14 |
| 2025 | 8 | 18 |
| 2026 | 8 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat exchanger8 Sep 2026US 12,728,694 B2Aptiv Technologies AG
- Integrated preheated pump-driven two-phase flow system11 Aug 2026US 12,707,596 B2Apaltek Co., Ltd.
- Heat transfer using ionic pumps19 May 2026US 12,633,506 B2Ventiva, Inc.
- Layered radiator for efficient heat rejection28 Apr 2026US 12,613,070 B2
- Thermal transfer structures for immersion cooling7 Apr 2026US 12,598,724 B2Microsoft Technology Licensing, LLC
- Heat exchanger, heat dissipation module, and compute device27 Aug 2026US 2026/0251398 A1Huawei Technologies Co., Ltd.
- Cooling system13 Aug 2026US 2026/0239580 A1Mitsubishi Heavy Industries, Ltd.
- Cooling arrangement and method for cooling at least one oil-to-air external heat exchanger6 Aug 2026US 2026/0227131 A1Hitachi Energy Ltd
- Heat exchanger for liquid coolant9 Jul 2026US 2026/0194308 A1Iceotope Group Limited
- System for cooling electronic devices in an electronic module4 Jun 2026US 2026/0156778 A1Iceotope Group Limited
Most cited
By later US patents
- CPU cooling system192US 6,166,907 A2000
- Optimized integral heat pipe and electronic circuit module arrangement113US 5,216,580 ASun Microsystems, Inc. · 1993
- Cooling apparatus for high-temperature medium by boiling and condensing refrigerant89US 6,005,772 ADenso Corporation · 1999
- Heat exchanger for electronic equipment87US 5,441,102 ASun Microsystems, Inc. · 1995
- Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation81US 5,587,880 AAavid Laboratories, Inc. · 1996