F28D 2021/0028
For cooling heat generating elements
Official title: {for cooling heat generating elements, e.g. for cooling electronic components or electric devices}
F28D2021/0028 (For cooling heat generating elements) appears on 1,222 US grants and 1,964 published applications in this corpus.
Search patents in F28D- Granted patents
- 1,222
- Published applications
- 1,964
- Assignees
- 836
- Inventors
- 3,773
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 7 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 5 |
| 2003 | 16 | 27 |
| 2004 | 20 | 35 |
| 2005 | 17 | 49 |
| 2006 | 34 | 47 |
| 2007 | 19 | 46 |
| 2008 | 9 | 41 |
| 2009 | 14 | 28 |
| 2010 | 22 | 27 |
| 2011 | 23 | 41 |
| 2012 | 12 | 69 |
| 2013 | 29 | 57 |
| 2014 | 32 | 76 |
| 2015 | 29 | 53 |
| 2016 | 35 | 65 |
| 2017 | 49 | 94 |
| 2018 | 67 | 107 |
| 2019 | 94 | 141 |
| 2020 | 104 | 156 |
| 2021 | 95 | 134 |
| 2022 | 84 | 163 |
| 2023 | 102 | 152 |
| 2024 | 119 | 128 |
| 2025 | 100 | 130 |
| 2026 | 59 | 92 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Cold plate and method for manufacturing cold plate6 Oct 2026US 12,753,978 B2Fujikura Ltd.
- Connector apparatus for electric charging cable6 Oct 2026US 12,755,866 B2The Board of Regents of the University of Oklahoma
- Heat exchanger8 Sep 2026US 12,728,694 B2Aptiv Technologies AG
- Wick structure for thin heatpipes8 Sep 2026US 12,729,918 B2Dell Products L. P.
- Thermal management system and method25 Aug 2026US 12,716,656 B2Transportation IP Holdings, LLC
- Heat exchanger8 Oct 2026US 2026/0309434 A1
- Oscillating heat pipe with phase change material1 Oct 2026US 2026/0298548 A1Raytheon Company
- Heat exchange mechanism, processing device, and processing machine1 Oct 2026US 2026/0298553 A1Hon. Precision, Inc.
- Wick structure for thin heatpipes24 Sep 2026US 2026/0287273 A1Dell Products L. P.
- Cooling element17 Sep 2026US 2026/0276316 A1Thermal Channel Technologies Oy
Most cited
By later US patents
- Integrated multilayered microfludic devices and methods for making the same242US 6,572,830 B1Motorola, Inc. · 2003
- Multilayered microfluidic DNA analysis system and method238US 6,544,734 B12003
- CPU cooling system192US 6,166,907 A2000
- Battery assembly with temperature control mechanism170US 5,756,227 AHonda Giken Kogyo Kabushiki Kaisha · 1998
- Compliant fluidic coolant hat138US 5,388,635 AInternational Business Machines Corporation · 1995