F27D 2003/0002
Involving positioning devices
Official title: {involving positioning devices, e.g. buffers, buffer zones}
F27D2003/0002 (Involving positioning devices) appears on 31 US grants and 5 published applications in this corpus.
Search patents in F27D- Granted patents
- 31
- Published applications
- 5
- Assignees
- 28
- Inventors
- 50
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 2 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Graphitization apparatus for manufacturing artificial graphite using laser23 Sep 2025US 12,422,191 B1Efc Co., Ltd.
- Method of adhering wafer and wafer adhering device17 Feb 2004US 6,692,221 B2Fujikoshi Machinery Corp.
- Apparatus for baking wafers12 Nov 2002US 6,478,578 B2Samsung Electronics Co., Ltd.
- Scrap charger14 May 2002US 6,389,054 B1SMS Demag AG
- Transport device and pallets for containers5 Sep 2000US 6,112,389 ABrain Power Consulting GmbH
- Centering device for metal blanks4 Jan 2024US 2024/0003628 A1EBNER Industrieofenbau GmbH
- Device and Method for Optimizing Natural Stone12 Jul 2018US 2018/0195801 A1Wishing Star Marble Co. Ltd.
- Glass substrate transfer system and robot arm thereof10 Mar 2016US 2016/0068425 A1Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Apparatus for baking wafers1 Aug 2002US 2002/0102511 A1Samsung Electronics Co., Ltd.
- Method of adhering wafer and wafer adhering device11 Jul 2002US 2002/0090589 A1Fujikoshi Machinery Corp.
Most cited
By later US patents
- Mobile holding furnace having metering pump111US 4,739,974 AStemcor Corporation · 1988
- Scrap charger7US 6,389,054 B1SMS Demag AG · 2002
- Apparatus for baking wafers7US 6,478,578 B2Samsung Electronics Co., Ltd. · 2002
- Method for positioning a container for measurement of wear in the container lining6US 5,706,090 ASpectra-Physics Visiontech Oy · 1998
- Installation for manufacture of ceramic products5US 5,000,655 A1991