Method of adhering wafer and wafer adhering device
AssigneeFujikoshi Machinery Corp.
InventorTetsuro Toya
Life of this patent
Estimating the term…
Abstract
The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed; positioning the carrier plate on the basis of a position of the detected mark; conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in the positioning step; and adhering the wafer at a prescribed position of the carrier plate.
Claims6
A method of adhering a wafer,
- comprising the steps of:
- heating a carrier plate;
- detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed;
- positioning the carrier plate on the basis of a position of the detected mark;
- conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in said positioning step;
- and
- adhering the wafer at a prescribed position of the carrier plate.
A wafer adhering device for adhering a wafer, which has been heated at a heating section, to a carrier plate,
- comprising:
- means for detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed;
- means for positioning the carrier plate on the basis of a position of the detected mark;
- means for conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in said positioning step;
- and
- means for mounting the wafer at a prescribed position of the carrier plate which has been conveyed to an adhering table.
Dependencies are inferred from the claim text.