C25D 1/22
Separating compounds
C25D1/22 (Separating compounds) appears on 44 US grants and 57 published applications in this corpus.
Search patents in C25D- Granted patents
- 44
- Published applications
- 57
- Assignees
- 47
- Inventors
- 158
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 3 |
| 2003 | 2 | 2 |
| 2004 | 1 | 2 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 0 |
| 2010 | 1 | 2 |
| 2011 | 2 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 5 |
| 2015 | 1 | 7 |
| 2016 | 1 | 3 |
| 2017 | 2 | 2 |
| 2018 | 4 | 5 |
| 2019 | 3 | 3 |
| 2020 | 4 | 3 |
| 2021 | 2 | 2 |
| 2022 | 0 | 1 |
| 2023 | 3 | 3 |
| 2024 | 1 | 3 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Release layer for metal foil with carrier and metal foil comprising the same2 Sep 2025US 12,408,279 B2Ymt Co., Ltd.
- Cobalt-tungsten alloy and method of fabricating the same21 Jan 2025US 12,203,154 B2Korea University Research and Business Foundation
- Controlling porosity of an interference lithography process by fine tuning exposure time27 Feb 2024US 11,914,304 B2The Board of Trustees of the University of Illinois
- Roll stamp for imprint device, and manufacturing method therefor23 May 2023US 11,656,545 B2Korea Institute of Machinery & Materials
- Nickel-cobalt material and method of forming28 Feb 2023US 11,591,684 B2Unison Industries, LLC
- Method of manufacturing an isolated porous material and an isolated porous material23 Oct 2025US 2025/0327201 A1Technische Universiteit Eindhoven
- Release layer for metal foil with carrier and metal foil comprising the same11 Jul 2024US 2024/0237229 A9Ymt Co., Ltd.
- Release layer for metal foil with carrier and metal foil comprising the same25 Apr 2024US 2024/0138075 A1Ymt Co., Ltd.
- Cobalt-tungsten alloy and method of fabricating the same25 Jan 2024US 2024/0026496 A1Korea University Research and Business Foundation
- Method for producing a mold11 May 2023US 2023/0147420 A1Essilor International
Most cited
By later US patents
- Composite and method for making thin copper foil60US 4,088,544 A1978
- Making and using an ultra-thin copper foil29US 6,270,889 B1Mitsui Mining & Smelting Co., Ltd. · 2001
- Making and using an ultra-thin copper foil15US 6,319,620 B1Mitsui Mining & Smelting Co., Ltd. · 2001
- Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier15US 6,924,043 B2Furkawa Circuit Foil Co., Ltd. · 2005
- Method for producing a metal layer by plating14US 4,188,240 ASony Corporation · 1980