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AssigneeFurkawa Circuit Foil Co., Ltd.
InventorsYuuji Suzuki, Akira Matsuda
Estimating the term…
An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper layer, wherein said ultra-thin copper layer and said peeling layer are provided between them with a strike plating layer and wherein said ultra-thin copper layer and said strike plating layer are one of a phosphorus-containing copper layer and a phosphorus-containing copper alloy layer and wherein said peeling layer and said strike plating layer are composed of materials that are distinct and different from each other.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper layer, wherein said ultra-thin copper layer and said peeling layer are provided between them with a strike plating layer comprised of one of a phosphorus-containing copper layer and a phosphorus-containing copper alloy layer, said strike plating layer is provided thereon with a copper plating ultra-thin layer, and said ultra-thin layer is provided thereon with said ultra-thin copper layer comprised of one of copper and a copper alloy and wherein said peeling layer and said strike plating layer are composed of materials that are distinct and different from each other.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper layer, wherein said ultra-thin copper layer and said peeling layer are provided between them with a strike plating layer comprised of one of a phosphorus-containing copper layer and a phosphorus-containing copper alloy layer, said strike plating layer is provided thereon with a copper plating ultra-thin layer, and said ultra-thin layer is provided thereon with said ultra-thin copper layer comprised of one of a phosphorus-containing copper layer and a phosphorus-containing copper alloy layer and wherein said peeling layer and said strike plating layer are composed of materials that are distinct and different from each other.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper layer, wherein said ultra-thin copper layer and said peeling layer are provided between them with a strike plating layer comprised of one of a phosphorus-containing copper layer and a phosphorus-containing copper alloy layer, said strike plating layer is provided thereon with an ultra-thin layer comprised of one of a phosphorus-containing copper layer and phosphorus-containing copper alloy layer, and the ultra-thin layer is provided thereon with said ultra-thin copper layer comprised of one of copper and a copper alloy and wherein said peeling layer and said strike plating layer are composed of materials that are distinct and different from each other.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper layer, wherein said ultra-thin copper layer and said peeling layer are provided between them with a strike plating layer comprised of one of a phosphorus-containing copper layer and a phosphorus-containing copper alloy layer, said strike plating layer is provided thereon with an ultra-thin layer comprised of one of a phosphorus-containing copper layer and phosphorus-containing copper alloy layer, and the ultra-thin layer is provided thereon with said ultra-thin copper layer comprised of one of a phosphorus-containing copper and a phosphorus-containing copper alloy and wherein said peeling layer and said strike plating layer are composed of materials that are distinct and different from each other.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer provided on the carrier foil, and an ultra-thin copper layer provided on the peeling layer, wherein a surface roughness Rz of a surface of the carrier foil facing the ultra-thin copper layer is in a range of 0.1 μm to 5 μm, a surface roughness Rz of a surface of the ultra-thin copper layer facing the carrier foil is in a range of 0.1 μm to 5 μm, and wherein there is disposed between said peeling layer and said ultra-thin copper layer a copper or copper alloy layer covering at least 90% of a surface of the peeling layer facing the ultra-thin copper layer at a position approximately 0.1 μm to 0.2 μm away from an average height of projections extending from a surface relief of a surface of the peeling layer facing the ultra-thin copper layer and a peel strength after hot bonding of at least 300° C. is 0.01 KN/m to 0.05 KN/m.
An ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer provided on the carrier foil, and an ultra-thin copper layer provided on the peeling layer, wherein a surface roughness Rz of a surface of the carrier foil facing the ultra-thin copper layer is in a range of 0.1 μm to 5 μm, a surface roughness Rz of a surface of the ultra-thin copper layer facing the carrier foil is in a range of 0.1 μm to 5 μm, and wherein there is disposed between said peeling layer and said ultra-thin copper layer a copper or copper alloy layer having a conductivity of at least 90% formed on a surface of the peeling layer facing the ultra-thin copper layer at a position approximately 0.1 μm to 0.2 μm away from an average height of projections extending from a surface relief of a surface of the peeling layer facing the ultra-thin copper layer, and a peel strength after hot bonding of at least 300° C. is 0.01 KN/m to 0.05 KN/m.
Dependencies are inferred from the claim text.