C22C 5/10
With cadmium as the next major constituent
Official title: with cadmium as the next major constituent
C22C5/10 (With cadmium as the next major constituent) appears on 27 US grants and 26 published applications in this corpus.
Search patents in C22C- Granted patents
- 27
- Published applications
- 26
- Assignees
- 13
- Inventors
- 35
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 2 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 2 | 7 |
| 2015 | 2 | 2 |
| 2016 | 3 | 2 |
| 2017 | 2 | 2 |
| 2018 | 2 | 3 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
| 2021 | 2 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Bonding wire for semiconductor devices9 Sep 2025US 12,412,864 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices24 May 2022US 11,342,299 B2Nippon Micrometal Corporation
- Materials for near field transducers and near field transducers containing same31 Aug 2021US 11,107,499 B2Seagate Technology LLC
- Materials for near field transducers, near field tranducers containing same, and methods of forming30 Mar 2021US 10,964,347 B2Seagate Technology LLC
- Materials for near field transducers, near field tranducers containing same, and methods of forming30 Jun 2020US 10,699,740 B2Seagate Technology LLC
- Bonding wire for semiconductor devices7 Apr 2022US 2022/0108971 A1Nippon Micrometal Corporation
- Materials for near field transducers and near field transducers containing same16 Jul 2020US 2020/0227086 A1Seagate Technology LLC
- Materials for near field transducers and near field transducers containing same21 Mar 2019US 2019/0088280 A1Seagate Technology LLC
- Bonding wire for semiconductor devices27 Dec 2018US 2018/0374816 A1Nippon Micrometal Corporation
- Materials for near field transducers and near field transducers containing same20 Dec 2018US 2018/0366153 A1Seagate Technology LLC
Most cited
By later US patents
- Metal alloys for the reflective or the semi-reflective layer of an optical storage medium19US 7,018,696 B2Target Technology Company, LLC · 2006
- Materials for near field transducers and near field transducers containing same18US 9,286,931 B2Seagate Technology LLC · 2016
- Materials for near field transducers, near field tranducers containing same, and methods of forming18US 9,502,070 B2Seagate Technology LLC · 2016
- Superelastic alloy structural geometry for ultrahigh mechanical damping14US 8,282,746 B2Massachusetts Institute of Technology · 2012
- Materials for near field transducers and near field transducers containing same10US 9,281,002 B2Seagate Technology LLC · 2016