C11D 7/245
Cyclic
Official title: {cyclic}
C11D7/245 (Cyclic) appears on 14 US grants and 24 published applications in this corpus.
Search patents in C11D- Granted patents
- 14
- Published applications
- 24
- Assignees
- 18
- Inventors
- 57
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 3 |
| 2020 | 1 | 0 |
| 2021 | 2 | 1 |
| 2022 | 0 | 2 |
| 2023 | 1 | 4 |
| 2024 | 0 | 3 |
| 2025 | 5 | 1 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition10 Feb 2026US 12,545,863 B2Nissan Chemical Corporation
- Treatment liquid and substrate washing method14 Oct 2025US 12,441,965 B2FUJIFILM Corporation
- Cleaning liquid for excessive powder removal, method for producing three-dimensional molded object, and set of object molding liquid and cleaning liquid19 Aug 2025US 12,391,903 B2Ricoh Company, Ltd.
- All-natural cleaner, lubricant and protectant composition24 Jun 2025US 12,338,418 B2
- All-natural cleaner, lubricant and protectant composition24 Jun 2025US 12,338,419 B2Boar Products, LLC
- Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and releasing and dissolving composition22 Jan 2026US 2026/0022313 A1Nissan Chemical Corporation
- Method of cleaning a surface8 May 2025US 2025/0149325 A1ASM IP Holding B. V.
- All-natural cleaner, lubricant and protectant composition5 Dec 2024US 2024/0400948 A1Boar Products, LLC
- All-natural cleaner, lubricant and protectant composition5 Dec 2024US 2024/0400950 A1Boar Products, LLC
- Surface Treatment Compositions and Methods1 Aug 2024US 2024/0254415 A1Fujifilm Electronic Materials U.S.A., Inc.
Most cited
By later US patents