C09J 7/387
Block-copolymers
Official title: {Block-copolymers}
C09J7/387 (Block-copolymers) appears on 256 US grants and 383 published applications in this corpus.
Search patents in C09J- Granted patents
- 256
- Published applications
- 383
- Assignees
- 126
- Inventors
- 928
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 4 |
| 2002 | 3 | 5 |
| 2003 | 7 | 8 |
| 2004 | 2 | 16 |
| 2005 | 6 | 7 |
| 2006 | 4 | 11 |
| 2007 | 5 | 9 |
| 2008 | 3 | 9 |
| 2009 | 6 | 6 |
| 2010 | 5 | 8 |
| 2011 | 4 | 7 |
| 2012 | 3 | 1 |
| 2013 | 1 | 12 |
| 2014 | 5 | 12 |
| 2015 | 2 | 18 |
| 2016 | 6 | 17 |
| 2017 | 13 | 17 |
| 2018 | 9 | 20 |
| 2019 | 16 | 30 |
| 2020 | 27 | 26 |
| 2021 | 5 | 34 |
| 2022 | 9 | 33 |
| 2023 | 7 | 19 |
| 2024 | 15 | 22 |
| 2025 | 23 | 16 |
| 2026 | 12 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Battery cell stack and manufacturing method thereof6 Oct 2026US 12,756,048 B2SK On Co., Ltd.
- Adhesive tape with polyurethane carrier25 Aug 2026US 12,716,011 B2Tesa SE
- Adhesive composition, thermosetting adhesive sheet, and printed wiring board7 Jul 2026US 12,677,376 B2Dexerials Corporation
- Co-extruded rubber-based multilayer adhesive assembly2 Jun 2026US 12,644,026 B23M Innovative Properties Company
- Pre-applied membrane having granular polymer outer protective layer26 May 2026US 12,637,593 B2GCP Applied Technologies Inc.
- Hot-Melt, Pressure-Sensitive Adhesive With A Wide Range Of Application-Temperature8 Oct 2026US 2026/0308424 A1Henry Company, LLC
- Curable resin composition, curable film, and layered film24 Sep 2026US 2026/0286195 A1Resonac Corporation
- Resin composition, and inter-layer insulating adhesive film, laminated circuit board, electronic component, and semiconductor device using same27 Aug 2026US 2026/0250560 A1Namics Corporation
- Method for producing semiconductor device and laminated body for temporary fixing6 Aug 2026US 2026/0226320 A1Resonac Corporation
- Pressure sensitive adhesive composition having improved heat-stability and use thereof6 Aug 2026US 2026/0226323 A1Sika Technology AG
Most cited
By later US patents
- Thermoplastic Elastomers175US 5,665,822 ALandec Corporation · 1997
- Hot melt adhesive composition and tape111US 3,932,328 AJohnson & Johnson · 1976
- Pressure sensitive adhesives111US 4,243,500 AInternational Coatings Limited · 1981
- Pressure-sensitive adhesives based on preferentially tackified immiscible elastomers92US 5,290,842 AAvery Dennison Corporation · 1994
- Tacky adhesive91US 4,080,348 AJohnson & Johnson · 1978