Method for producing semiconductor device and laminated body for temporary fixing

A method for producing a semiconductor device, comprising:

• preparing a laminated body for temporary fixing comprising a support member, a light absorption layer, and a temporary fixing material layer comprising a cured product of a thermosetting resin component in this order from the support member;
• temporarily fixing a semiconductor member to the support member via the light absorption layer and the temporary fixing material layer;
• processing the semiconductor member temporarily fixed to the support member;
• and
• irradiating the light absorption layer of the laminated body for temporary fixing with light from the support member side to separate the semiconductor member from the support member,
• wherein a push-in depth when on a surface of the temporary fixing material layer on a side in which the semiconductor member is disposed, a nanoindentation method using a Berkovich indenter is performed under a condition of 25° C. such that a load is increased at a loading rate of 20 μN/second for 5 seconds, retained at 100 μN for 2 seconds after the load reaches 100 μN, and decreased at an unloading rate of 20 μN/second for 5 seconds until the load is 0 mN is 600 nm or more.