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US 2026/0226323 A1Published application
Pressure sensitive adhesive composition having improved heat-stability and use thereof
AssigneeSika Technology AG
InventorsMarkus MAZUROWSKI, Jan SPENGLER
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Abstract
A radiation curable adhesive composition including: a) At least one styrene-based polymer, b) At least one tackifying resin, c) At least one photoinitiator, and d) At least one crosslinking agent, wherein the at least one photoinitiator can be activated with irradiation having a wavelength of 365-500 nm, to initiate the curing reactions of the adhesive composition.
Claims17
A radiation curable adhesive composition comprising:
- a) At least one styrene-based polymer SP,
- b) At least one tackifying resin TR,
- c) At least one photoinitiator PI, and
- d) At least one crosslinking agent CA,
- wherein the at least one photoinitiator PI can be activated with irradiation having a wavelength of 365-500 nm to initiate the curing reactions of the adhesive composition.
2 more elements
Dependencies are inferred from the claim text.