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US 12,677,376 B2Granted
Adhesive composition, thermosetting adhesive sheet, and printed wiring board
AssigneeDexerials Corporation
InventorsJun Yamamoto, Toshiyuki Minegishi, Kazuhiro Date
Life of this patent
Estimating the term…
Abstract
An adhesive composition has a low dielectric constant, a low dielectric loss tangent, and an excellent folding endurance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 30%.
Claims15
An adhesive composition, comprising:
- with respect to the total of 100 parts by mass of the adhesive composition,
- 75 to 90 parts by mass of a styrene elastomer,
- 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end;
- and
- totally more than 0 parts by mass and no more than 10 parts by mass of both a liquid epoxy resin and an epoxy resin curing agent,
- wherein the styrene ratio of the styrene elastomer is less than 30%, and
- wherein the glass transition temperature after curing is-40 to 40° C.
4 more elements
Dependencies are inferred from the claim text.