C09J 7/241
Polyolefin
Official title: {Polyolefin, e.g.rubber}
C09J7/241 (Polyolefin) appears on 379 US grants and 548 published applications in this corpus.
Search patents in C09J- Granted patents
- 379
- Published applications
- 548
- Assignees
- 240
- Inventors
- 1,288
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 2 |
| 2002 | 14 | 7 |
| 2003 | 7 | 4 |
| 2004 | 3 | 12 |
| 2005 | 2 | 9 |
| 2006 | 2 | 6 |
| 2007 | 4 | 11 |
| 2008 | 1 | 8 |
| 2009 | 1 | 10 |
| 2010 | 2 | 7 |
| 2011 | 5 | 20 |
| 2012 | 2 | 14 |
| 2013 | 4 | 18 |
| 2014 | 8 | 25 |
| 2015 | 10 | 20 |
| 2016 | 11 | 33 |
| 2017 | 11 | 27 |
| 2018 | 17 | 31 |
| 2019 | 17 | 44 |
| 2020 | 21 | 31 |
| 2021 | 22 | 50 |
| 2022 | 19 | 55 |
| 2023 | 23 | 28 |
| 2024 | 29 | 36 |
| 2025 | 31 | 27 |
| 2026 | 13 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Strong and stretchable seam tape11 Aug 2026US 12,703,810 B2Avient Protective Materials B.V.
- Adhesive material and electrochemical apparatus containing same30 Jun 2026US 12,668,719 B2Ningde Amperex Technology Limited
- Thermal-activated, peelable adhesive tape30 Jun 2026US 12,668,724 B2Tesa SE
- Polyurethane hot melt adhesive composition, and preparation method thereof23 Jun 2026US 12,662,615 B2Henkel AG & Co. KGaA
- Coextruded polymeric adhesive article9 Jun 2026US 12,649,868 B23M Innovative Properties Company
- A corrosion protective wrapping23 Jul 2026US 2026/0209568 A1
- Conductive adhesive film, method of treating adherend, and method of manufacturing semiconductor device9 Jul 2026US 2026/0193494 A1Resonac Corporation
- Conductive adhesive film, method of treating adherend, and method of manufacturing semiconductor device25 Jun 2026US 2026/0176503 A1Resonac Corporation
- Film tapes21 May 2026US 2026/0139158 A1Vybond Group, Inc.
- Packaging comprising a packaging container as well as a multi-layer sealing part21 May 2026US 2026/0139162 A1
Most cited
By later US patents
- In-mold label film and method245US 6,004,682 AAvery Dennison Corporation · 1999
- Composite facestocks and liners121US 4,713,273 AAvery International Corporation · 1987
- Articles that include a polymer foam and method for preparing same84US 6,103,152 A3M Innovative Properties Company · 2000
- In-mold labelling a coextruded, stretched and annealed label68US 5,435,963 A1995
- Opaque, matte, biaxially oriented, multilayer polypopylene film, process for the production thereof, and the use thereof68US 5,516,563 AHoechst Aktiengesellschaft · 1996