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US 2026/0176503 A1Published application
Conductive adhesive film, method of treating adherend, and method of manufacturing semiconductor device
AssigneeResonac Corporation
InventorsSeiji KAI, Keiichi HATAKEYAMA, Naoki EBINA, Masayoshi NISHIMOTO, Tomohito MOROSAKI, Yukihiro IWANAGA, Miharu KOSHINO, Naohiro KIMURA
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Abstract
A conductive adhesive film including an adhesive layer located on an adherend side, and a base material layer, in which a surface resistance value of the conductive adhesive film is from 1×107 Ω/□ to 1×1012 Ω/□.
Claims20
A conductive adhesive film comprising:
- an adhesive layer located on an adherend side;
- and
- a base material layer,
- wherein a surface resistance value of the conductive adhesive film on a side opposite to the adhesive layer side is from 1×107 Ω/□ to 1×1012 Ω/□.
1 more element
A conductive adhesive film comprising:
- an adhesive layer located on an adherend side;
- and
- a base material layer,
- wherein the conductive adhesive film whose adhesive force to the adherend changes before and after the adhesive layer is irradiated with an active energy ray, is used for an electrostatic chuck.
1 more element
Dependencies are inferred from the claim text.