Conductive adhesive film, method of treating adherend, and method of manufacturing semiconductor device

2:

• The conductive adhesive film according to claim 1, further comprising a conductive layer at a side opposite to a surface of the base material layer at the adhesive layer side.

3:

• The conductive adhesive film according to claim 2, wherein the conductive layer contains a conductive polymer material.

4:

• The conductive adhesive film according to claim 1, wherein a conductive layer is not disposed at a surface of the base material layer at the adhesive layer side.

5:

• The conductive adhesive film according to claim 1, wherein a surface resistivity of the conductive adhesive film at the side opposite to the adhesive layer side is from 2×108Ω/□ to 1×1012Ω/□.

6:

• The conductive adhesive film according to claim 1, wherein an elastic modulus of the base material layer at 23° C. is 3.5 GPa or less.

7:

• The conductive adhesive film according to claim 1, wherein a light transmittance of the conductive adhesive film is 85% or less at least one wavelength included in a wavelength range of from 380 nm to 780 nm.

8:

• The conductive adhesive film according to claim 1, wherein the base material layer contains a polyolefin.

10:

• The method of treating an adherend according to claim 9, wherein the processing treatment is etching, CVD, or PVD.

11:

• The method of treating an adherend according to claim 9, wherein the adherend contains at least one selected from the group consisting of glass, ceramic, quartz, and a compound semiconductor.