C09J 2483/008
In the pretreated surface to be joined
Official title: in the pretreated surface to be joined
C09J2483/008 (In the pretreated surface to be joined) appears on 12 US grants and 16 published applications in this corpus.
Search patents in C09J- Granted patents
- 12
- Published applications
- 16
- Assignees
- 14
- Inventors
- 42
- Latest grant
- 22 Aug 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 3 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 1 |
| 2015 | 1 | 0 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 2 |
| 2019 | 1 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Selective bonding method of polymer substrates10 Aug 2021US 11,084,898 B2Daegu Gyeongbuk Institute of Science and Technology
- Bonding process5 Feb 2019US 10,195,834 B2Aortech International plc
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- Bonding process23 Aug 2016US 9,421,737 B2Aortech International plc
- Weather sealing23 Jul 2026US 2026/0209559 A1Dow Chemical Thailand Limited
- Curable silicone composition23 Jul 2026US 2026/0209582 A1Dow Silicones Corporation
- Article suitable for food contact and method for producing same25 Sep 2025US 2025/0296751 A1
- Method for joining silicone rubber using plasma treatment27 Feb 2025US 2025/0065573 A1Applied Plasma Inc Co., Ltd.
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Most cited
By later US patents
- Bonding process20US 6,273,985 B1Xerox Corporation · 2001
- Bonding process19US 6,485,130 B2Xerox Corporation · 2002
- Primer compositions16US 5,326,844 AShin-Etsu Chemical Co., Ltd. · 1994
- Ethylene-vinyl acetate silicone rubber adherent laminates and method of production12US 3,971,884 ANational Distillers and Chemical Corporation · 1976
- Bonding process5US 9,216,558 B2Aortech International plc · 2015