Selective bonding method of polymer substrates

A selective bonding method of polymer substrates, the method comprising:

• forming a first polymer substrate on a carrier substrate, forming a first parylene layer on the first polymer substrate, and forming a first electrode pattern on the first parylene layer;
• forming a second polymer substrate on the first parylene layer on which the first electrode pattern is formed, forming a second parylene layer on the second polymer substrate, and forming a second electrode pattern on the second parylene layer;
• removing an area of the second parylene layer other than that under the second electrode pattern;
• forming a mask pattern on the second polymer substrate to cover at least the second electrode pattern;
• applying plasma treatment on the second polymer substrate on which the mask pattern is formed;
• removing the mask pattern;
• and
• removing the carrier substrate.

A method for manufacturing a three-dimensional structure, the method comprising:

• preparing a structure comprising a first polymer substrate, a first parylene layer, and a second polymer substrate, wherein the structure comprises a first area at an interface between the first parylene layer and the second polymer substrate where the first parylene layer is not bonded to the second polymer substrate and a second area at the interface between the first parylene layer and the second polymer substrate where the first parylene layer is bonded to the second polymer substrate;
• and
• injecting a fluid into the first area formed between the first parylene layer and the second polymer substrate,
• wherein a hollow is formed in the first area between the first parylene layer and the second polymer substrate by the fluid injection to form a three-dimensional structure.