C09J 2479/026
In the substrate
Official title: in the substrate
C09J2479/026 (In the substrate) appears on 9 US grants and 14 published applications in this corpus.
Search patents in C09J- Granted patents
- 9
- Published applications
- 14
- Assignees
- 13
- Inventors
- 36
- Latest grant
- 23 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 2 |
| 2017 | 0 | 1 |
| 2018 | 0 | 2 |
| 2019 | 0 | 1 |
| 2020 | 4 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 4 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Reactive hot-melt adhesive composition, and bonded body and method for producing same23 Jul 2024US 12,043,774 B2Resonac Corporation
- Film for manufacturing semiconductor parts27 Dec 2022US 11,535,776 B2Mitsui Chemicals Tohcello, Inc.
- High-temperature and flame-resistant colored adhesive tape, use of a substrate for its manufacture, and cable harness including such an adhesive tape3 Aug 2021US 11,081,255 B2Coroplast Fritz Müller GmbH & Co. KG
- Film for manufacturing semiconductor parts8 Dec 2020US 10,858,547 B2Mitsui Chemicals Tohcello, Inc.
- Composite article7 Apr 2020US 10,611,929 B2BASF SE
- Modified polybenzoxazole, modified polybenzoxazole sheet, cleaning sheet, and transfer member provided with cleaning function22 Jun 2023US 2023/0192957 A1Nitto Denko Corporation
- Threadlike adhesive body22 Dec 2022US 2022/0403210 A1Nitto Denko Corporation
- Laminate floor and manufacturing process thereof23 Jun 2022US 2022/0194068 A1Jiangsu Langyue New Materials Technology Co., Ltd.
- Recording paper, use thereof, and method for producing recording paper21 Apr 2022US 2022/0119682 A1Yupo Corporation
- Reactive hot-melt adhesive composition, and bonded body and method for producing same14 Apr 2022US 2022/0112405 A1Showa Denko Materials Co., Ltd.
Most cited
By later US patents
- Water resistant intumescent fire retardant coating53US 8,808,850 B2Arclin · 2014
- Release sheet24US 4,609,589 AOji Paper Co., Ltd. · 1986
- Film for manufacturing semiconductor parts2US 10,858,547 B2Mitsui Chemicals Tohcello, Inc. · 2020
- High-temperature and flame-resistant colored adhesive tape, use of a substrate for its manufacture, and cable harness including such an adhesive tape2US 11,081,255 B2Coroplast Fritz Müller GmbH & Co. KG · 2021
- Film for manufacturing semiconductor parts2US 11,535,776 B2Mitsui Chemicals Tohcello, Inc. · 2022