C09J 2433/001
In the barrier layer
Official title: in the barrier layer
C09J2433/001 (In the barrier layer) appears on 19 US grants and 41 published applications in this corpus.
Search patents in C09J- Granted patents
- 19
- Published applications
- 41
- Assignees
- 26
- Inventors
- 102
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 3 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 2 |
| 2016 | 1 | 2 |
| 2017 | 0 | 5 |
| 2018 | 1 | 5 |
| 2019 | 4 | 3 |
| 2020 | 2 | 2 |
| 2021 | 0 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 4 |
| 2025 | 0 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Pressure-sensitive adhesive sheet and use thereof5 May 2026US 12,617,985 B2Nitto Denko Corporation
- Adhesive tape20 Aug 2024US 12,065,596 B2Mitsubishi Chemical Corporation
- Semiconductor processing adhesive tape and method of manufacturing semiconductor device12 Dec 2023US 11,842,916 B2Lintec Corporation
- Adhesive tape for encapsulating electronic constructions8 Feb 2022US 11,242,469 B2Tesa SE
- Barrier elements on a microstructured article having adhesive sealing layer and specified modulus of elasticity29 Dec 2020US 10,877,191 B23M Innovative Properties Company
- Transfer film and anti-glare molded body24 Apr 2025US 2025/0129271 A1Dai Nippon Printing Co.Ltd.
- Anionic explosion-proof membrane and preparation method therefor23 Jan 2025US 2025/0026954 A1Hubei Institute of Aerospace Chemical Technology
- Adhesive tape31 Oct 2024US 2024/0360340 A1Mitsubishi Chemical Corporation
- Optical laminate, polarizing plate, and image display device31 Oct 2024US 2024/0361507 A1FUJIFILM Corporation
- Ultra-quiet backing-paper-free cold laminating film and preparation method thereof26 Sep 2024US 2024/0318042 A1Zhejiang Fulai New Materials Co., Ltd
Most cited
By later US patents
- Method for dicing a semiconductor wafer44US 4,720,317 ABando Chemical Industries, Ltd. · 1988
- Pressure sensitive adhesive film with barrier layer28US 4,968,559 ABando Chemical Industries, Ltd. · 1990
- Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same18US 4,913,960 ABando Chemical Industries, Ltd. · 1990
- Pressure sensitive adhesives with reducible adhesive force using radiation, and films therewith9US 4,818,621 ABando Chemical Industries, Ltd. · 1989
- Adhesive tape for encapsulating electronic constructions2US 11,242,469 B2Tesa SE · 2022