Semiconductor processing adhesive tape and method of manufacturing semiconductor device
AssigneeLintec Corporation
InventorsKazuto Aizawa, Jun Maeda
Life of this patent
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Abstract
A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.
Claims6
A semiconductor processing adhesive tape comprising a base, a buffer layer provided at least on one surface of the base, and an adhesive layer provided on another surface of the base, wherein
- a breaking energy at 23° C. of the buffer layer is 13 to 80 MJ/m3.
A semiconductor processing adhesive tape comprising a base and an adhesive layer provided at least to a surface of the base, wherein a breaking energy at 23° C. of the base is 13 to 80 MJ/m3.
Dependencies are inferred from the claim text.