Method for dicing a semiconductor wafer

A method for dicing a semiconductor wafer to form dice which comprises:

• (a) placing and fixing the wafer on a dicing film which comprises a base film permeable to ultraviolet light and a layer of a pressure sensitive adhesive formed on one side of the base film to fix thereon the wafer, the adhesive comprising:
• (i) at least one elastic polymer selected from the group consisting of a polymer comprising acrylic acid ester copolymers, and a saturated copolyester comprising a dibasic carboxylic acid and a dihydroxy alcohol;
• (ii) and ultraviolet light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and having a molecular weight of not more than about 1000, in amounts of about 15-200 parts by weight in relation to 100 parts by weight of the elastic polymer;
• (iii) a tacifier in amounts of about 10-200 parts by weight in relation to 100 parts by weight of the elastic polymer;
• (iv) anhydrous silica powder in amounts of about 1-30 parts by weight in relation to 100 parts by weight of the elastic polymer;
• and
• (v) a photopolymerization initiator in a sufficient amount to induce the photopolymerization of the ultraviolet light polymerizable acrylic acid ester;
• (b) dicing the wafer;
• (c) applying the ultraviolet light to the other side of the dicing film to substantially reduce the adhesive force of the dicing film;
• and
• (d) removing the resultant dice from the dicing film.