C09J 153/025
Modified
Official title: {modified}
C09J153/025 (Modified) appears on 323 US grants and 355 published applications in this corpus.
Search patents in C09J- Granted patents
- 323
- Published applications
- 355
- Assignees
- 150
- Inventors
- 830
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 8 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 6 | 0 |
| 2001 | 19 | 1 |
| 2002 | 6 | 11 |
| 2003 | 9 | 20 |
| 2004 | 13 | 11 |
| 2005 | 7 | 23 |
| 2006 | 6 | 11 |
| 2007 | 15 | 16 |
| 2008 | 8 | 8 |
| 2009 | 3 | 12 |
| 2010 | 17 | 16 |
| 2011 | 4 | 11 |
| 2012 | 0 | 1 |
| 2013 | 8 | 11 |
| 2014 | 9 | 15 |
| 2015 | 7 | 11 |
| 2016 | 8 | 16 |
| 2017 | 9 | 15 |
| 2018 | 10 | 16 |
| 2019 | 14 | 19 |
| 2020 | 15 | 20 |
| 2021 | 7 | 31 |
| 2022 | 12 | 17 |
| 2023 | 10 | 14 |
| 2024 | 12 | 16 |
| 2025 | 16 | 10 |
| 2026 | 7 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive composition, thermosetting adhesive sheet, and printed wiring board7 Jul 2026US 12,677,376 B2Dexerials Corporation
- Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structure12 May 2026US 12,624,261 B2Lintec Corporation
- Thermoplastic moulding materials with improved property profile17 Mar 2026US 12,577,389 B2Clariant International Ltd.
- Styrenic block copolymers and methods of preparation thereof24 Feb 2026US 12,559,619 B2Kraton Corporation
- Carrier film for semi-conductor wafer processing17 Feb 2026US 12,552,975 B2Tredegar Surface Protection, LLC
- Dynamically crosslinked tough adhesive with recyclability9 Apr 2026US 2026/0098189 A1UT-Battelle, LLC
- Adhesive composition and production method for adhesive composition19 Mar 2026US 2026/0078288 A1Kuraray Co., Ltd.
- Alkali-dispersible type hot melt pressure-sensitive adhesive5 Mar 2026US 2026/0062593 A1
- Laminate and method for producing laminate6 Nov 2025US 2025/0340706 A1Asahi Kasei Kabushiki Kaisha
- Hot melt adhesive compositions including a three polymer blend6 Nov 2025US 2025/0340764 A1
Most cited
By later US patents
- Adhesive for secure topical attachment to the skin and comfortable removal156US 6,211,263 B1The Procter & Gamble Company · 2001
- Adherent gels, composites, and articles101US 7,193,002 B2Applied Elastomerics, Inc. · 2007
- Fully saturated petroleum resin and hot melt pressure sensitive adhesive formulations utilizing same as tackifier94US 4,714,749 AExxon Research & Engineering Co. · 1987
- Collapsible gel articles89US 7,661,164 B2Applied Elastomerics, Inc. · 2010
- Absorbent article with adhesive strip86US 4,136,699 AH. B. Fuller Company · 1979