Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structure

A high-frequency dielectric heating adhesive, comprising

• a thermoplastic resin (A);
• and
• a dielectric filler (B) that generates heat when a high-frequency electric field is applied, wherein
• an amount of the dielectric filler (B) contained in the high-frequency dielectric heating adhesive is 5% or more by volume and 50% or less by volume,
• the thermoplastic resin (A) comprises a styrene copolymer resin (a1),
• an amount of the styrene copolymer resin (a1) contained in the thermoplastic resin (A) is 40% or more by volume and 100% or less by volume,
• the styrene copolymer resin (a1) has a styrene monomer unit content of 10% or more by mass and 90% or less by mass,
• a total amount of the thermoplastic resin (A) and the dielectric filler (B) contained in the high-frequency dielectric heating adhesive is 80% or more by mass,
• the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and
• the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε′r) of 0.005 or more,
• where tan δ is a dielectric loss tangent at 23 degrees C. and a frequency of 40.68 MHz, and
• ε′r is a relative dielectric constant at 23 degrees C. and a frequency of 40.68 MHz.